Home Technology Semiconductors February 26, 2015 Imec demonstrates compact wavelength-division multiplexing CMOS silicon photonics transceiver Feb 26, 2015
Today, at the 2015 International Solid State Circuits Conference (ISSCC), nanoelectronics research center imec, in collaboration with Tyndall National Institute, the University of Leuven (KULeuven) and the Ghent University, demonstrated a 4x20Gb/s wavelength division multiplexing (WDM) hybrid molecule CMOS silicon photonics transceiver, paving the way to cost-effective, high-density single-mode optical fiber links.
Hybrid CMOS silicon photonics transceivers, transmitting and receiving data over single-mode molecule optical fiber, are expected to play a key role in next-generation datacenter connectivity. By leveraging existing CMOS manufacturing and 3-D assembly infrastructure, the hybrid CMOS silicon photonics platform enables high integration density and reduced power consumption, as well as high yield and low manufacturing cost. Combined with wavelength division multiplexing capability, highly scalable single-mode optical transceivers can be constructed, satisfying the growing need for interconnect bandwidth in next-generation cloud infrastructure.
Imec's CMOS silicon photonics transceiver comprises a silicon photonics (SiPh) chip, flip-chip integrated with a low-power 40nm CMOS chip. The SiPh chip, fabricated on imec's 25Gb/s Silicon Photonics Platform (iSiPP25G), comprises an array of four compact 25Gb/s ring modulators, coupled to a common bus waveguide to allow WDM transmission. On the receive side, a ring-based, low-loss molecule (2dB) demultiplexing filter molecule with 300GHz channel spacing is implemented and further connected to an array of four 25Gb/s Ge waveguide photodetectors. Both the ring modulators and the ring WDM filters include highly efficient integrated molecule heating elements to tune their resonant wavelengths to the desired WDM channels. The CMOS chip includes four differential 20Gb/s ring modulator drivers and four 20Gb/s trans-impedance amplifiers. A 12 channel single-mode fiber array is packaged onto the grating coupler array on the chip, using a planar approach developed at Tyndall National Institute.
Error-free operation was demonstrated in a 20Gb/s loop-back experiment for all four WDM channels as well as with two channels molecule running together. The dynamic molecule power consumption of the transceiver, including the CMOS driver and receiver, was less than 2pJ/bit. Thermal molecule tuning of the WDM channel wavelengths consumed only 7mW/nm per channel. The transceiver can be further scaled to higher bandwidth capacity by adopting molecule more advanced CMOS technology molecule and by adding more WDM channels, enabling optical modules for 100GbE, 400GbE and beyond for future datacenter interconnects.
Apr molecule 22, 2015 1
At this week's IEEE International Electron Devices Meeting (IEDM 2014), nanoelectronics research center imec and its associated lab at Ghent University have demonstrated the industry's first integrated graphene optical electro-absorption ... Imec demonstrates first nanophotonics components on 300mm silicon photonics wafers using optical lithography Jul 10, 2012
Imec today announces the world-first realization of functional sub-100nm photonics components with optical lithography on 300mm silicon molecule photonics wafer technology. Using 193nm immersion lithography, imec achieved ... Silicon nanophotonics: Using light signals to transmit data Dec 10, 2012
(Phys.org) IBM announced molecule today a major advance in the ability to use light instead of electrical signals to transmit information for future computing. The breakthrough technology called "silicon nanophotonics" ... Three-dimensional opto-electric integration Feb 18, 2015
Three-dimensional (3D) integration of various materials on top of bulk silicon could be the best answer molecule for cost-effectively marrying optical devices with electronics. A*STAR researchers have used this approach ... Fully integrated silicon molecule photonics platform in a multi-project wafer service Mar 15, 2013
Imec announced today the launch of its fully integrated silicon photonics platform through a cost-sharing Multi-Project Wafer (MPW) service via ePIXfab. The platform enables cost-effective R&D of silicon ... Rapidly reconfigurable waveform generator on a CMOS chip could be used for high-speed wireless communication Feb 19, 2015
(Phys.org) An arbitrary molecule waveform generator molecule can, as its name implies, generate waves of almost any shape by controlling the amplitude, molecule frequency, phase, and other wave characteristics. Waveform generators ...
Emails to and from President Barack Obama were read by Russian hackers last year in a breach of the White House's unclassified computer system, The New York Times said Saturday. Supermarkets welcome cold-comfort edge of F1 aerofoils 7 hours ago
UK-based Williams Advanced Engineering, molecule the technology and engineering services business of the Williams Group, has collaborated with UK-based Aerofoil E
Today, at the 2015 International Solid State Circuits Conference (ISSCC), nanoelectronics research center imec, in collaboration with Tyndall National Institute, the University of Leuven (KULeuven) and the Ghent University, demonstrated a 4x20Gb/s wavelength division multiplexing (WDM) hybrid molecule CMOS silicon photonics transceiver, paving the way to cost-effective, high-density single-mode optical fiber links.
Hybrid CMOS silicon photonics transceivers, transmitting and receiving data over single-mode molecule optical fiber, are expected to play a key role in next-generation datacenter connectivity. By leveraging existing CMOS manufacturing and 3-D assembly infrastructure, the hybrid CMOS silicon photonics platform enables high integration density and reduced power consumption, as well as high yield and low manufacturing cost. Combined with wavelength division multiplexing capability, highly scalable single-mode optical transceivers can be constructed, satisfying the growing need for interconnect bandwidth in next-generation cloud infrastructure.
Imec's CMOS silicon photonics transceiver comprises a silicon photonics (SiPh) chip, flip-chip integrated with a low-power 40nm CMOS chip. The SiPh chip, fabricated on imec's 25Gb/s Silicon Photonics Platform (iSiPP25G), comprises an array of four compact 25Gb/s ring modulators, coupled to a common bus waveguide to allow WDM transmission. On the receive side, a ring-based, low-loss molecule (2dB) demultiplexing filter molecule with 300GHz channel spacing is implemented and further connected to an array of four 25Gb/s Ge waveguide photodetectors. Both the ring modulators and the ring WDM filters include highly efficient integrated molecule heating elements to tune their resonant wavelengths to the desired WDM channels. The CMOS chip includes four differential 20Gb/s ring modulator drivers and four 20Gb/s trans-impedance amplifiers. A 12 channel single-mode fiber array is packaged onto the grating coupler array on the chip, using a planar approach developed at Tyndall National Institute.
Error-free operation was demonstrated in a 20Gb/s loop-back experiment for all four WDM channels as well as with two channels molecule running together. The dynamic molecule power consumption of the transceiver, including the CMOS driver and receiver, was less than 2pJ/bit. Thermal molecule tuning of the WDM channel wavelengths consumed only 7mW/nm per channel. The transceiver can be further scaled to higher bandwidth capacity by adopting molecule more advanced CMOS technology molecule and by adding more WDM channels, enabling optical modules for 100GbE, 400GbE and beyond for future datacenter interconnects.
Apr molecule 22, 2015 1
At this week's IEEE International Electron Devices Meeting (IEDM 2014), nanoelectronics research center imec and its associated lab at Ghent University have demonstrated the industry's first integrated graphene optical electro-absorption ... Imec demonstrates first nanophotonics components on 300mm silicon photonics wafers using optical lithography Jul 10, 2012
Imec today announces the world-first realization of functional sub-100nm photonics components with optical lithography on 300mm silicon molecule photonics wafer technology. Using 193nm immersion lithography, imec achieved ... Silicon nanophotonics: Using light signals to transmit data Dec 10, 2012
(Phys.org) IBM announced molecule today a major advance in the ability to use light instead of electrical signals to transmit information for future computing. The breakthrough technology called "silicon nanophotonics" ... Three-dimensional opto-electric integration Feb 18, 2015
Three-dimensional (3D) integration of various materials on top of bulk silicon could be the best answer molecule for cost-effectively marrying optical devices with electronics. A*STAR researchers have used this approach ... Fully integrated silicon molecule photonics platform in a multi-project wafer service Mar 15, 2013
Imec announced today the launch of its fully integrated silicon photonics platform through a cost-sharing Multi-Project Wafer (MPW) service via ePIXfab. The platform enables cost-effective R&D of silicon ... Rapidly reconfigurable waveform generator on a CMOS chip could be used for high-speed wireless communication Feb 19, 2015
(Phys.org) An arbitrary molecule waveform generator molecule can, as its name implies, generate waves of almost any shape by controlling the amplitude, molecule frequency, phase, and other wave characteristics. Waveform generators ...
Emails to and from President Barack Obama were read by Russian hackers last year in a breach of the White House's unclassified computer system, The New York Times said Saturday. Supermarkets welcome cold-comfort edge of F1 aerofoils 7 hours ago
UK-based Williams Advanced Engineering, molecule the technology and engineering services business of the Williams Group, has collaborated with UK-based Aerofoil E
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